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Science/Engineering Wafer Level 3-D ICs Process Technology

Posted on 2010-03-16

Name:	Science/Engineering Wafer Level 3-D ICs Process Technology
ASIN/ISBN:	0387765328
Language:	English
File size:	11.1 Mb
Publish Date:	2008
ISBN:	0387765328
Pages:	410 pages
File Type:	PDF
File Size:	11,1 MB
Other Info:	Springer

Science/Engineering Wafer Level 3-D ICs Process Technology

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Chuan Seng Tan, Ronald J. Gutmann, L. Rafael Reif, "Wafer Level 3-D ICs Process Technology"

This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging.

This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.

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	Technical Process Aware Information Systems Bridging People and Software Through Process Technology no description

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