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Science/Engineering Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems)
Posted on 2010-03-16
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More Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems) Product Description: This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry. Download links
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