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Technical Wei-Ping Pan - Techniques in Thermal Analysis

Posted on 2010-08-18




Name:Technical Wei-Ping Pan - Techniques in Thermal Analysis
ASIN/ISBN:0803156162
Publisher:ASTM International
Publish Date:2007-01
Pages:134 pages
File size:5.27 Mb
Publisher: ASTM International
Publish Date: 2007-01
ISBN: 0803156162
File Type: PDF
Pages: 134 pages
File Size: 5.27 MB
   Technical Wei-Ping Pan - Techniques in Thermal Analysis

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Wei-Ping Pan - Techniques in Thermal Analysis: Hyphenated Techniques, Thermal Analysis of the Surface, and Fast Rate Analysis

Nine peer-reviewed papers reflect the latest research in thermal analysis, including fast scan calorimetry in both instrument development and techniques.

Sections cover:

Hyphenated Techniques—seven papers cover the use of thermogravimetric analysis (TGA) with another technique. Topics deal with temperature-modulated differential scanning calorimetry; improved modeling when using hyphenated techniques; a simple calibration method for the quantitative use of mass spectrometry with TGA for a variety of encountered off gases; and much more.

Fast Rate Analysis—covers fast scan calorimetry in both instrument development and techniques. Fast heating rates were employed to study epoxy curing and fast rate analysis allowed the separation of the glass transition and cure exotherm.

Thermal Analysis of the Surface—discusses the use of a modified atomic force microscope (AFM), or Micro-Thermal Analysis, that uses the AFM probe as a thermal device.

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