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Technical Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging (Synthesis Lectures on Computational Electromagnetics)

Posted on 2010-04-28




Name:Technical Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging (Synthesis Lectures on Computational Electromagnetics)
ASIN/ISBN:1598292447
Author:Jong-Hoon Lee
Publisher:Morgan and Claypool Publishers (2008)
Pages:Paperback, 108 pages
File size:4.6 Mb
   Technical Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging (Synthesis Lectures on Computational Electromagnetics)


Author: Jong-Hoon Lee


Publisher: Morgan and Claypool Publishers (2008)


Binding: Paperback, 108 pages


pricer: $40.00


ISBN-10: 1598292447


editorialreviews

This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules.




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