Reflow: Reflow Soldering Processes

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	Reflow Soldering Processes
	Reflow Soldering Processes by Ning-Cheng Lee; ISBN 0750672188; Publisher: Elsevier Science & Technology Books; November 2001 password : www.blueportal.org Tags : Soldering Processes Reflow , Posted on 2010-04-14

	Science/Engineering Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies
	Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies Publisher: Newnes; Pages: 280; 2001-12-15; ISBN 0750672188; PDF; 11 MBFocused on technological innovations in the field of electronics packaging ... Tags : Soldering Chip , Posted on 2010-04-14

	Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies (repost)
	Ning-Cheng Lee, "Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies" Newnes; 2001; ISBN: 0750672188; 280 pages; PDF; 10,2 MB Focused on technological innovations in the field of electronics pac ... Tags : repost Soldering Chip , Posted on 2010-09-20