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Lectures on Numerical Methods in Bifurcation Problems
Methods for Finding Zeros in Polynomials
Lectures on Stochastic Flows and Applications
Educational Psychology by Edward L. Thorndike
The Last Days of Tolstoy by V. G. Chertkov
Globalization and Responsibility
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History of the Incas by Pedro Sarmiento de Gamboa
Linear Algebra: Theorems and Applications
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A Short Biographical Dictionary of English Literature
Lectures on Sieve Methods and Prime Number Theory
Dollars and Sense by William Crosbie Hunter
The Theory of the Theatre by Clayton Hamilton
The Mathematics of Investment
Occupiers of Wall Street: Losers or Game Changers
The Solution of the Pyramid Problem
Lectures on Moduli of Curves
Walden by Henry David Thoreau
Methods for Finding Zeros in Polynomials
Lectures on Stochastic Flows and Applications
Educational Psychology by Edward L. Thorndike
The Last Days of Tolstoy by V. G. Chertkov
Globalization and Responsibility
Lectures on Siegel Modular Forms and Representation by Quadratic Forms
Lectures on Topics In One-Parameter Bifurcation Problems
History of the Incas by Pedro Sarmiento de Gamboa
Linear Algebra: Theorems and Applications
Lectures on Stochastic Differential Equations and Malliavin Calculus
A Short Biographical Dictionary of English Literature
Lectures on Sieve Methods and Prime Number Theory
Dollars and Sense by William Crosbie Hunter
The Theory of the Theatre by Clayton Hamilton
The Mathematics of Investment
Occupiers of Wall Street: Losers or Game Changers
The Solution of the Pyramid Problem
Lectures on Moduli of Curves
Walden by Henry David Thoreau
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Silver Metallization: Stability and Reliability (Engineering Materials and Processes)
Posted on 2010-03-15
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More Silver has the lowest resistivity of all metals, which makes it an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits. Over the past ten years, extensive research has been conducted to address the thermal and electrical stability, as well as processing issues which, to date, have prevented the implementation of silver as an interconnect metal. Silver Metallization: Stability and Reliability is the first book to discuss current knowledge of silver metallization and its potential as a favorable candidate for implementation as a future interconnect material for integrated circuit technology. Silver Metallization: Stability and Reliability provides detailed information on a wide range of experimental, characterization and analysis techniques. It also presents the novel approaches used to overcome the thermal and electrical stability issues associated with silver metallization. Readers will learn about the: * preparation and characterization of elemental silver thin films and silver-metal alloys; * formation of diffusion barriers and adhesion promoters; * evaluation of the thermal stability of silver under different annealing conditions; * evaluation of the electrical properties of silver thin films under various processing conditions; * methods of dry etching of silver lines and the integration of silver with low-k dielectric materials. As a valuable resource in this emerging field; Silver Metallization: Stability and Reliability will be very useful to students, scientists, engineers and technologists in the fields of integrated circuits and microelectronics research and development.
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