NanoparticleEngineering zip (1420059114)

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Ungyu Paik, Jea-Gun Park, "Nanoparticle Engineering for Chemical-mechanical Planarization"

In the development of next-generation nanoscale devices, higher speed and lower power operation is the name of the game. Increasing reliance on mobile computers, mobile phone, and other electronic devices demands a greater degree of speed and power. As chemical mechanical planarization (CMP) progressively becomes perceived less as black art and more as a cutting-edge technology, it is emerging as the technology for achieving higher performance devices.

Nanoparticle Engineering for Chemical-Mechanical Planarization explains the physicochemical properties of nanoparticles according to each step in the CMP process, including dielectric CMP, shallow trend isolation CMP, metal CMP, poly isolation CMP, and noble metal CMP. The authors provide a detailed guide to nanoparticle engineering of novel CMP slurry for next-generation nanoscale devices below the 60nm design rule. They present design techniques using polymeric additives to improve CMP performance. The final chapter focuses on novel CMP slurry for the application to memory devices beyond 50nm technology.

Most books published on CMP focus on the polishing process, equipment, and cleaning. Even though some of these books may touch on CMP slurries, the methods they cover are confined to conventional slurries and none cover them with the detail required for the development of next-generation devices. With its coverage of fundamental concepts and novel technologies, this book delivers expert insight into CMP for all current and next-generation systems.

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	Science/Engineering Chemical Mechanical Planarization of Microelectronic Materials Joseph M. Steigerwald, Shyam P. Murarka, Ronald J. Gutmann, "Chemical Mechanical Planarization of Microelectronic Materials" Wiley-Interscience \| 1997-02-07 \| ISBN: 0471138274 \| 337 pages \| PDF \| 13.9 MBChemical Mechanical Planarization (CM ...
	Science/Engineering Chemical Engineering Design Project: A Case Study Approach (Topics in Chemical Engineering,) by M. S. Ray Chemical Engineering Design Project: A Case Study Approach (Topics in Chemical Engineering,) by M. S. RayPublisher: Routledge \| January 1, 1989 \| ISBN: 2881247121 \| Pages: 392 \| PDF \| 4.97 MBThis new edition follows the original format, whi ...
	Science/Engineering Microelectronic Applications of Chemical Mechanical Planarization Microelectronic Applications of Chemical Mechanical PlanarizationPublisher: Wiley \| ISBN: 0471719196 \| edition 2007 \| PDF \| 734 pages \| 11.41 MBChemical mechanical planarization, or CMP, has become one of the newest and most important fabri ...
	Science/Engineering Boiling Heat Transfer And Two-Phase Flow, Second Edition (Series in Chemical and Mechanical Engineering) L S Tong, Y S Tang,"Boiling Heat Transfer And Two-Phase Flow, Second Edition"CRC \| February 1, 1997 \| PDF \| ISBN: 1560324856 \| 572 pages \| 8.36mbThis second edition provides reliable information in predicting the thermal hydraulic behavior ...
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	Technical Nanoparticle Engineering for Chemical-Mechanical Planarization: Fabrication of Next-Generation Nanodevices ISBN: 1420059114 Publisher: CRC Press Author: Ungyu Paik, Jea-Gun ParkDescription:In the development of next-generation nanoscale devices, higher speed and lower power operation is the name of the game. Increasing reliance on mobile compute ...

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