Science/Engineering H. Fukuda - Rapid Thermal Processing for Future Semiconductor Devices (0444513396)

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Science/Engineering H. Fukuda - Rapid Thermal Processing for Future Semiconductor Devices

Posted on 2010-03-16

Name:	Science/Engineering H. Fukuda - Rapid Thermal Processing for Future Semiconductor Devices
ASIN/ISBN:	0444513396
Language:	English
File size:	6.73 Mb
Publish Date:	2003
ISBN:	0444513396
Pages:	160
File Type:	PDF
File Size:	6.73 MB
Other Info:	Elsevier Science

Science/Engineering H. Fukuda - Rapid Thermal Processing for Future Semiconductor Devices

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H. Fukuda - Rapid Thermal Processing for Future Semiconductor Devices

This volume is a collection of papers which were presented at the 2001 International Conference on Rapid Thermal Processing (RTP 2001) held at Ise Shima, Mie, on November 14-16, 2001. This symposium is second conference followed the previous successful first International RTP conference held at Hokkaido in 1997. The RTP 2001 covered the latest developments in RTP and other short-time processing continuously aiming to point out the future direction in the Silicon ULSI devices and II-VI, III-V compound semiconductor devices.

This book covers the following areas: advanced MOS gate stack, integration technologies, advancd channel engineering including shallow junction, SiGe, hetero-structure, novel metallization, inter-connect, silicidation, low-k materials, thin dielectrics including gate dielectrics and high-k materials, thin film deposition including SiGe, SOI and SiC, process and device modelling, Laser-assisted crystallization and TFT device fabrication technologies, temperature monitoring and slip-free technologies.

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