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Green Electronics Design and Manufacturing: Implementing Lead-Free and RoHS Compliant Global Products

Posted on 2010-12-09




Name:Green Electronics Design and Manufacturing: Implementing Lead-Free and RoHS Compliant Global Products
ASIN/ISBN:0071495940
File size:2.3 Mb
ISBN: 0071495940
Pages: 384 Pages
File Type: PDF
File Size: 2,3 MB
Other Info: Mc.Gr aw-H ill Prof.ess ional 2008
   Green Electronics Design and Manufacturing: Implementing Lead-Free and RoHS Compliant Global Products

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Sammy Shina, “”

Successfully Design and Manufacture Reliable Environmentally-Friendly Electronic Products

This state-of-the-art resource brings together contributions by a team of experts from the total electronics supply chain who show how to master the strategy, design, test and implementation issues of meeting global environmental regulations.

Edited by the founder of the New England Lead-Free Consortium and filled with over 130 detailed illustrations, Green Electronics Design and Manufacturing features:

Guidance for lead-free conversions while maintaining quality and reliability for printed circuit board production and rework of surface mount technology and palted through holes

Restriction of hazardous substances (RoHS) compliance for hex-chrome and future halogen free issues

Detailed coverage of global environmental regulations and their impact on manufacturing and design processes

Techniques for managing corporate strategy and project design teams for green products

Proven methods for testing and analyzing green products

Proven methods for dealing with the adverse results of green production such as tin whiskers and finish interactions

Inside this Cutting-Edge Guide to Creating Green Electronic Products

• Basics, Test Methods, and Experimental Techniques for Green Quality and Reliability • Electronics Industry Global Environmental Regulations • Managing Corporate Strategy, Design Projects, and Teams for Green Products • Converting to Lead-Free Electronics Manufacturing, Including Rework, for SMT, BGA, and PTH • Conversion Issues with Design Changes, Laminates, IC Packages, and Printed Circuit Boards • Adverse Consequences of Lead-Free, Including Tin Whiskers and Finish Interactions • Nanotechnology and Its Future in Electronics Applications (20080730)

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