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Audiobooks & Video Training Fundamentals of Microsystems Packaging (repost)

Posted on 2010-10-29




Name:Audiobooks & Video Training Fundamentals of Microsystems Packaging (repost)
ASIN/ISBN:0071371699
Publish Date:1 edition (May 8, 2001)
Pages:967 pages
File size:11.8 Mb
ISBN: 0071371699
Pages: 967 pages
File Type: PDF
File Size: 11,8 Mb
Other Info: McGraw-Hill Professional; 1 edition (May 8, 2001)
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Rao Tummala, " Fundamentals of Microsystems Packaging"

Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. You’ll find:

*Full coverage of electrical, mechanical, chemical, and materials aspects of each technology

*Easy-to-read schematics and block diagrams

*Fundamental approaches to all system issues

*Examples of all common configurations and technologies—wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others

*Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes

*Basics of electrical and reliability testing

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