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Tapan Gupta, "Copper Interconnect Technology"

Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began to influence circuit performance and will be the primary factors in the evolution of nanoscale ULSI technology. Because metallic conductivity and resistance to electromigration of bulk copper (Cu) are better than aluminum, use of copper and low-k materials is now prevalent in the international microelectronics industry. As the feature size of the Cu-lines forming interconnects is scaled, resistivity of the lines increases. At the same time electromigration and stress-induced voids due to increased current density become significant reliability issues. Although copper/low-k technology has become fairly mature, there is no single book available on the promise and challenges of these next-generation technologies. In this book, a leader in the field describes advanced laser systems with lower radiation wavelengths, photolithography materials, and mathematical modeling approaches to address the challenges of Cu-interconnect technology.

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	Science/Engineering IC Interconnect Analysis IC Interconnect Analysis Springer \| 2002-05 \| ISBN: 1402070756 \| 320 pages \| PDF \| 9,5 MbAs integrated circuit (IC) feature sizes scaled below a quarter of a micron, thereby defining the deep submicron (DSM) era, there began a gradual shift ...
	Science/Engineering RapidIO: The Embedded System Interconnect RapidIO: The Embedded System Interconnect380 pages \| Wiley; 1 edition (January 14, 2005) \| ISBN: 0470092912 \| PDF \| 5 MbRapidIO - The Embedded System Interconnect brings together one essential volume on RapidIO interconnect technology, prov ...
	Science/Engineering Foundations of Interconnect and Microstrip Design, 3 Ed. T. C. Edwards, M. B. Steer "Foundations of Interconnect and Microstrip Design, 3 Ed." Wiley \| 2001-01-17 \| ISBN: 0471607010 \| 532 pages \| PDF \| 26,2 MB Building on the success of the previous two editions Foundations of Interconnect and ...
	Science/Engineering Fred D. Barlow, Aicha Elshabini - Ceramic Interconnect Technology Handbook Fred D. Barlow, Aicha Elshabini - Ceramic Interconnect Technology HandbookCRC \| 2007 \| ISBN: 0849335574 \| Pages: 456 \| PDF \| 10.09 MBCeramics were among the first materials used as substrates for mass-produced electronics, and they remain a ...
	Science/Engineering Interconnect-Centric Design for Advanced SOC and NOC Jari Nurmi, H. Tenhunen, J. Isoaho, A. Jantsch, "Interconnect-Centric Design for Advanced SOC and NOC" Springer \| 2004 \| ISBN: 1402078358 \| 453 pages \| PDF \| 6,8 MB In Interconnect-centric Design for Advanced SoC and NoC, we have tried ...
	Physics ASM Specialty Handbook: Copper and Copper Alloys Author: J. R. Davis (Editor)Publisher: ASM InternationalPublish Date: August 1, 2001ISBN: 0871707268Pages: 600This handbook is a comprehensive guide to the selection and applications of copper and copper alloys, which constitute one of the ...

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