Science/Engineering Area Array Packaging Handbook: Manufacturing and Assembly (0071374930)

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Ken Gilleo, "Area Array Packaging Handbook: Manufacturing and Assembly"

This book covers area array packaging at the cutting-edge. This is the first book to bring BGA, CSP, and Flip Chip together - teaching design, application, and manufacturing how-tos. As pagers, cell phones, and other portable electronics shrink while demand for features and functions grows, the need for better, faster, smaller, cooler high-density interconnects (HDI) becomes more critical. "The Area Array Packaging Handbook" brings you the details you need on this rapidly expanding field in microelectronics packaging.Filled with hands-on, leading edge information engineers need for day-to-day decision making, "Area Array Packaging Handbook" is an unbeatable resource for success in today's fast-paced world of HDI. Look for these highlights inside: the hottest technologies in electronics packaging - BGA, CSP, and Flip Chip - all in one reference; details on MEMs technology; pros and cons of each technology in various applications; solutions for difficult packaging ramifications of HDI design concepts; detailed coverage of critical reliability and testing issues; help with design, materials, and manufacturing processes; problem-solving approaches to conception, construction, assembly, and applications; world-class expert contributors; and, 400 illustrations. It covers advances, applications, concepts, design, economics, opimization, equipment, future, technology, materials, processes, and productivity.

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	Science/Engineering Integrated Circuit Packaging, Assembly and Interconnections: Trends and Options Integrated Circuit Packaging, Assembly and Interconnections: Trends and OptionsPublisher: Springer \| Pages: 300 \| 2007-05-16 \| ISBN 0387281533 \| PDF \| 23 MBIntegrated Circuit Packaging, Assembly and Interconnections is intended as a multi ...
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